Rugged electronics packaging
Enclosures, chassis and interface boxes coordinated with qualified fabrication and assembly partners.

Electronic warfare and C4ISR equipment is moving toward smaller, modular systems deployed from air, ground and autonomous platforms. LIGHTNX supports the rugged packaging, interconnect, power and installation work that carries that electronics onto a platform.
Modular electronics only delivers its flexibility when enclosures, power, cabling and mounting are engineered and documented to the same standard as the equipment inside. That is the layer LIGHTNX supports.
Scope is defined per requirement and may be performed by LIGHTNX or by qualified manufacturing partners under LIGHTNX coordination.
Enclosures, chassis and interface boxes coordinated with qualified fabrication and assembly partners.
Cable assemblies and interconnect sourcing, including RF cable assemblies to customer specification.
Power harnessing and distribution assemblies for vehicle and shelter installations.
Racks, trays and transit cases with integrated power and data routing.
Panel layouts, connector selection support and panel harnessing.
Sensor and antenna mounting hardware, brackets and installation kits.
Breakout boxes, test harnesses and fixtures for integration and acceptance.
Build-to-print production and supplier coordination for low- and mid-volume hardware.
A representative installation package. Scope is defined per requirement.
LIGHTNX does not develop EW, signals-intelligence or communications technology. We support the packaging, interconnect and installation of equipment designed by the program and its system developers.
Program applications describe where LIGHTNX capabilities can support. They do not describe completed or current contracts, customers or programs.
Tell us what the program needs, when it is needed and which documentation matters. We will review it and define the path to delivery.